D-Wave Quantum Inc. (NYSE: QBTS) Targets Processor Development Scalability with Advanced Cryogenic Packaging Initiative
D-Wave launches initiative to develop advanced cryogenic packaging for both gate-model and annealing quantum processors. The program will expand multichip packaging capabilities, manufacturing equipment, and processes. Initiative leverages expertise from NASA’s Jet Propulsion Laboratory (“JPL”) for superconducting bump-bond technology. The goal is to increase interconnectivity and scalability for architectures reaching 100,000 qubits. D-Wave Quantum Inc. (NYSE: QBTS) (“D-Wave”), a leader in quantum computing systems, software, and services, has announced a strategic development program to expand its capabilities in cryogenic packaging, designed to advance and scale both gate-model and annealing quantum processors. The initiative underscores the company’s focus on hardware innovation to…